Infocus Archive
Infocus Archive

• New Global TV platform powers all TV trends
  NXP's global TV550 platform integrates an unequalled number of IP blocks on 1-chip for more TV content, best-in-class TV picture quality, networked TV and low energy TV.
• Phonak and NXP enable breakthrough functionality in hearing systems
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• Check out the improved Selection Guides
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• RF power that's driving the market
  Experience for yourself RF power technology that's driving the market with best-in-class efficiency, power and ruggedness. Our LDMOS technology draws on NXP’s heritage of proven product innovation in RF, spanning over 30 years.
• The industry's fastest ARM Cortex-M3 MCUs
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• NXP Semiconductors Third Quarter 2008 Results
  NXP reports sales in line with expectations and positive operational cash flow.
• Unleash your products potential with NXP at ESC Boston
  At ESC Boston, Oct. 28-29, NXP will showcase our recently released Cortex M3 LPC1700, ARM9 LPC2900, and LPC313x products. On Oct. 28th, NXP will host FREE training sessions on these new products. All attendees will receive a FREE evaluation kit.
• Smart solutions for the next generation
  That's what you'll discover when you meet NXP Semiconductors at Cartes 2008.
• Milestone environmentally conscious design
  NXP has sold 250 million fluorescent lighting driver ICs. Fluorescent lamps are highly energy-efficient lighting solutions that save 80% energy.
• NXP's low cost ARM9 with high speed USB 2.0 OTG
  Our LPC313x family provides embedded designers a cost effective, power efficient single chip solution for USB connectivity.
• New FlatPower packages with MEGA Schottky rectifiers
  NXP releases new SOD123W and SOD128. Due to the packages' clip bond technology, the new MEGA devices deliver high-power capability comparable to SMA packages. At the same time, the package height is just 1 mm instead of 2 mm, enabling much smaller designs
• NXP & Austria Card enable secure cashless payment
  with Lufthansa Miles & More Credit Card. The new EMV card powered by NXP’s SmartMX chip features MasterCard® PayPass™ technology for fast, secure transactions is now offering its holders the convenience of secure, Tap & Go™ payment transactions.
• SimPort - Free MOSFET simulation tool
  Check out NXP's new Design Portal and use SimPort to optimize the selection of your MOSFETs within a specific application environment and rapidly assess MOSFET performance within a power circuit.
• Check out NXP's improved package selector!
  The updated package section now contains an improved package selector. Select a package from the search results and you will see the package details and, newly added, the products available in the selected package.
• NXP's differentiating TV viewing experiences at IBC2008
  At IBC2008 we demonstrated a wide range of set-top box and DTV solutions that allow access to more content with better picture quality, anytime, anywhere at home and on-the-go. If you haven't seen us at IBC, follow the links to find our solutions:
• New NXP security chip breaks speed record for eGovernment transactions
  NXP's P5CD081, industry's highest performance contactless IC for ePassport and electronic identification applications processes transactions twice as fast while offering the highest security level EAL5+ level Common Criteria certification.
• Redesign of NXP Organization
  The redesign program for the NXP organization is part of our transformation to be a globally competitive semiconductor company. These essential measures help NXP on its journey to be a company that delivers consistent and solid profitable growth.
• Now available, NXP RF Manual 11th edition!
  NXP's RF Manual makes design-in work much easier. In this 11th edition we added several new applications, exciting new developments and products.
• Magneti-Marelli selects NXP’s latest video decoder
  NXP’s SAF7115 video decoder is automotive-qualified and suitable for high performance, in-car telematics platforms, including in-car video reception, in-car entertainment and in-car navigation.
• Sustainability Report 2007 available now
  Our first external Sustainability Report shows the progress on sustainability NXP has made in the short time that we have been operating as an independent company.
• NXP cooperates with Audi at China Olympics
  NXP cooperates with Audi to execute Journaline activities at the Beijing 2008 Olympic games. NXP supports with the AM/FM Car DSP SAF77xx Family and its software defined digital radio platform.
• Differentiating TV viewing experiences at IBC2008
  At IBC NXP will present a wide line-up of unique, high-performing set-top box solutions. Contact your NXP account manager to visit our meeting suite (Sep 12-16, Amsterdam).
• NXP & iBiquity develop next-generation HD Radioâ„¢.
  Dedicated Single Chip Software Solution Supports HD Radio Technology, DAB, DAB+, DRM and T-DMB Digital Radio Broadcast Standards.
• Le Coq Sportif uses NXP NFC and RFID for branding
  To redevelop the brand, Le Coq Sportif, supplier of sportswear, promoted their sportswear during Roland Garros using NXP RFID and NFC tags to create a strong emotional relationship with the brand.
• Acquisition Conexant’s STB Operations Completed
  This deal makes NXP a top three technology player in the DVS market with a unique IP, technology and talent portfolio to show for. NXP’s scale and infrastructure will further extend this leadership and reduce cost to create a powerful organization.
• Class-D answers automotive power issues
  Discover how NXP’s A-BCD process technology turns Class-D amplifiers into a viable alternative to class AB in automotive applications.
• High Performance Automotive MOSFETs in LFPAK
  Delivering the ultimate in performance, NXP’s new range of High Performance Automotive (HPA) MOSFETs in the compact, thermally enhanced LFPAK provides reduced on-resistance along with improved ruggedness and thermal performance.
• NXP leads contactless market
  NXP Semiconductors tops ABI Research’s latest Vendor Matrix ranking in contactless payment, ticketing and NFC ICs, putting us in pole position for the second year running.
• Completing Joint Venture ST-NXP Wireless
  NXP and STMicroelectronics today announced the closing of the deal bringing together key wireless operations of both companies into ST-NXP Wireless, a deal they announced on April 10th, 2008. The joint venture will start operations on August 2nd.
• NXP launches intelligent HDMI Switches
  NXP’s highly automated TDA999x ICs HDMI 1.3 smart switches handle up to 4 HDMI 1.3 inputs on the TV pro